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Ceramique By Arctic Silver non conductive high performance thermal compund
Premium High Density Ceramic Based Thermal Compound
Designed especially for high-power CPU's and heatsinks and water cooling solutions. The Evolution of Cool!
Ceramique does not contain any silicone.
The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability.
During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a
minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final
consistency designed for long-term stability.
(This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then
re-solidify when they cool. The viscosity changes that Ceramique goes through are much more subtle and ultimately much more effective.)
Excellent Stability:
Ceramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator:
Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated
thermal diode imbedded in the CPU core.
Easy Clean Up:
Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions.
Innovative Dispenser:
The 2.5-gram Ceramique is the first product available in our proprietary thermal compound syringe. Our new syringe is more compact, easier to handle and
dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to
determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.
Specifications:
Thermal Resistance:
<0.007°C-in2/Watt (0.001 inch layer)
Thermal Conductance:
>200,000W/m2.°C (0.001 inch layer)
Average Particle Size:
<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
Temperature limits:
Peak: –150°C to >180°C Long-Term: –150°C to 125°C
Coverage Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will cover approximately 20 square inches.
Important Reminder: Due to the unique shapes and sizes of the particles in Ceramique, it will take a minimum of 12 hours to achieve maximum particle to
particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the
heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this
"break-in" period.
Premium High Density Ceramic Based Thermal Compound
Designed especially for high-power CPU's and heatsinks and water cooling solutions. The Evolution of Cool!
Ceramique does not contain any silicone.
The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability.
During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a
minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final
consistency designed for long-term stability.
(This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then
re-solidify when they cool. The viscosity changes that Ceramique goes through are much more subtle and ultimately much more effective.)
Excellent Stability:
Ceramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator:
Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated
thermal diode imbedded in the CPU core.
Easy Clean Up:
Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions.
Innovative Dispenser:
The 2.5-gram Ceramique is the first product available in our proprietary thermal compound syringe. Our new syringe is more compact, easier to handle and
dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to
determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.
Specifications:
Thermal Resistance:
<0.007°C-in2/Watt (0.001 inch layer)
Thermal Conductance:
>200,000W/m2.°C (0.001 inch layer)
Average Particle Size:
<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
Temperature limits:
Peak: –150°C to >180°C Long-Term: –150°C to 125°C
Coverage Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will cover approximately 20 square inches.
Important Reminder: Due to the unique shapes and sizes of the particles in Ceramique, it will take a minimum of 12 hours to achieve maximum particle to
particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the
heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this
"break-in" period.
Ceramique Thermal Compund
